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Home > COB Technology








COB Module Package Research and Development
 
COB circuit design、manufacture、assembly and test
Wire bond on a variety of PCB ( FR4 , FR5 , FPC , Ceramics )
Provide image、power 、RF module assembly
Small batch order is acceptable
COB and SMD coexist  
COB Component L/W ratio < 1 / 25 is acceptable  
 







 
COB Capability
Capable of handling six different dice
High Die Bond Accuracy < 50 um
Bond Height Differential : 0.9mm
Line Quantity/ Program: 3000 Max
Wire Diameter: 0.7mil ~ 1.3 mil
Loop Shape Options: 11Max
Bond Placement Error: 1st →3.5um, 2nd →12.5um
Ball Size:1.4~3 wire diameter, repeatability →0.2mil